With data center AI workloads rapidly increasing and GPU power densities exceeding 100 W/cm², new approaches to cooling large-scale IT infrastructures are urgently required. This presentation introduces the H-DINI project, which addresses the challenges facing IT infrastructure as processor thermal design powers (TDP) continue to rise. The project is part of the Advanced Digitalisation programme at Vinnova and brings together 14 partners from Sweden, Denmark, and the UK.

 

A key success factor for H-DINI is the ability to test and validate cooling solutions at a realistic scale for upcoming generations of GPU installations in data centers. However, due to high costs, acquiring large numbers of the latest-generation GPUs for the project is not feasible. To address this challenge, a low-cost chip load emulator has been developed for use within the project and for related research activities. The presentation will also provide a brief overview of the chip load emulator and its potential applications.