Keynotes & Workshops
Note: The information is updated continuously
Keynote: När kylningen blir arkitektur – Thermal management vid en brytpunkt
AI- och HPC-plattformar har drivit effektdensiteter till nivåer där kylningen inte längre är en stödfunktion, utan den avgörande begränsningen för fortsatt prestandaskalning. När komponenter passerar kilowattnivåer räcker det inte längre att bygga större kylflänsar eller pumpa mer vätska. ΔT-budgeten är i praktiken förbrukad – den termiska resistanskedjan från hotspot till omgivning har blivit systemets flaskhals.
Denna keynote belyser orsakerna till varför thermal management nu måste flytta hela vägen in mot källan, med en förflyttning mot direct-to-chip och direct-die-lösningar med mikrokanaler, jet-impingement och hotspot-optimerade strukturer markerar ett skifte från generell värmeavledning till extremt lokal temperaturkontroll, där hundratals W/cm² inte längre är undantag utan norm.
Är nästa steg mikrofluidik integrerad i kislet, där etsade kylkanaler samdesignas med kretslayout för att minimera total termisk resistans och möjliggöra tätare 3D-stackning?
Detta är inte en inkrementell förbättring – det är en systemomställning. Tillverkningsprocesser, materialval, tätningsteknik, pumpar, flödesdistribution och datacentrets energiinfrastruktur måste börja ses i ett sammanhängande system, med hela enheten som ett holistiskt system av system.
Thermal management är således inte längre en komponentfråga – det är en arkitekturfråga. Och i den omställningen förändras hela värdekedjan. Frågan är därmed inte om kylningen förändras, utan om vi hinner anpassa hela kedjan innan nästa thermal wall sätter gränsen.
Keynote: När kylningen blir arkitektur – Thermal management vid en brytpunkt
Speaker: Jussi Myllyluoma, Cool Sweden Initiative
Time: 09:00 – 09:45
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Keynote: Cool AI – Cooling infrastructure for next generation AI systems
Speaker: Jonas Gustavsson, Senior Researcher, RISE
Time: 09.45 – 10.30
Workshop: Accelerate Electronics Thermal Design with GPU- and AI-Powered Ansys Discovery
Rising power density, tighter packaging, and shorter development cycles are driving the need for faster thermal design exploration in electronics systems. Traditional CPU-based simulation workflows, while accurate, often limit rapid iteration during the concept design phases. This presentation demonstrates how Ansys Discovery leverages GPU based meshing, solving, and postprocessing to deliver near–real-time, physics-based thermal simulation, enabling rapid assessment of electronics cooling concepts during the earliest phases of design. Attendees will see how Discovery supports interactive geometry editing and immediate thermal feedback for evaluating different cooling strategies.
Discovery combines automated high-quality meshing with a robust and accurate physics solver, providing an intuitive user experience that allows engineers to set up simulations and obtain thermal insights without deep CFD expertise
The presentation also shows how Discovery fits into a multi-fidelity electronics thermal workflow, where early design concepts explored in Discovery can be seamlessly handed off to Ansys Icepak for detailed CFD analysis and downstream validation. In addition, Discovery integrates Ansys Engineering Copilot— an AI-driven innovation built into the platform. Together, Together, GPU-powered performance, physics-based accuracy, and AI-driven guidance enable engineers to accelerate thermal design and make confident decisions throughout the product development lifecycle.
Workshop: Accelerate Electronics Thermal Design with GPU- and AI-Powered Ansys Discovery
Speaker: Antoine Briens, Senior Specialist, Ansys
Workshop: Thermal Interface Materials
This workshop will present thermal interface materials (TIMs) in various forms. Drawing on extensive experience in the development of TIMs, Kerafol have also successfully introduced innovative approaches to their application. Kerafol is a German manufacturer with fully in-house production capabilities. Among other topics, they will present their injection-moulded TIM pad technology.
Workshop: Thermal Interface Materials
Speaker: Wolfgang Hoefer & Marcin Mierzewski, Kerafol
Workshop: New Technology for Directed Airflow in Tight Spaces
This workshop will present a breakthrough in directed airflow for space-constrained electronics: an ultra-compact, silicon-based MEMS microfan designed to deliver high static pressure exactly where thermal bottlenecks occur. Fabricated entirely using thin-film piezoelectric MEMS technology, the device moves air through oscillating silicon membranes—without rotating parts, coils, or magnets—enabling a new class of solid-state cooling components.
With a footprint of just 6.5 × 7.5 × 1.2 mm and full SMT compatibility, the microfan can be mounted directly onto PCBs using standard automated assembly. Unlike conventional centrifugal fans that lose efficiency in restricted airflow paths, this MEMS device is optimized for pushing air through tight channels, providing up to 380 Pa peak static pressure at approximately 0.5 SLM free flow.
The session will explore how semiconductor-based airflow generation opens new possibilities for localized cooling in compact, power-constrained systems, and how MEMS fabrication enables scalable integration into next-generation electronic designs.
Workshop: New Technology for Directed Airflow in Tight Spaces
Speaker: Josef Hansson & Mattias Holmer, Myvox
Workshop: Driving Innovation in Thermal Management
Thermal management is becoming a critical enabler for innovation across automotive, telecom, and AI-driven data communication industries. In this workshop we delve into the increasing technical and changing demands on bondline thickness and the need for scalable, high-performance and application-specific solutions. Nolato Silikonteknik’s upcoming TIM production facility in Hallsberg, drives innovation to meet next-generation thermal challenges.
Workshop: Driving Innovation in Thermal Management
Speaker: Edmund Tai, Thermal Product Manager & Jörgen Gustafsson, Ph.D. Nolato